Replaces bulky multi-component assemblies with a single monolithic diamond structure for sensitive, ultra-high-density integrated circuits.
BDD core absorbs microwave interference across a broad frequency range
Intrinsic diamond base layer prevents short-circuiting against bare dies
Built-in temperature monitoring directly above the die
Optional metal coating blocks incoming external interference
Sign in to see the multi-layer diamond stack, layer thicknesses, and micro-channel / heat-fin options. Custom DFM available for any layer configuration.
Sign in to see the full dimension table and micro-channel / heat-fin options. Custom DFM is available for any footprint.
Engineered for the most demanding ultra-high-density integrated circuit packaging applications.
System-in-Package (SiP) designs
The intrinsic diamond base layer prevents electrical short-circuiting against bare dies, allowing the heat spreader to be placed in direct, intimate contact with silicon. This maximizes heat transfer while the BDD core absorbs inter-chip microwave interference.
Thermal management for laser arrays
Lasers are highly sensitive to temperature drift. The lid's built-in temperature sensing provides real-time, highly localized junction temperature readings directly above the PIC, allowing system logic to adjust cooling instantly without latency from external sensors.
Sign in to see the standard sizes we offer across the PIC-to-MCM range.