Co-Packaged Optics place optical engines directly adjacent to switch ASICs, creating extreme thermal challenges that diamond solves.
Diamond instantly spreads heat from densely integrated optical engines and switch ASICs, far exceeding copper and aluminum nitride.
Critical for maintaining optical alignment in co-packaged modules. Eliminates thermal gradients across switch dies.
Match industry-standard CPO component architectures. Custom DFM for any OEM footprint.
Diamond substrates designed for specific CPO applications, matching industry-standard component architectures.
Sign in to see the full 6C-to-OEM dimension mapping table and discuss Custom DFM for specific footprints.