CPO optical engines separate the photonic integrated circuit (PIC) from the electronic integrated circuit (EIC) in a 2.5D architecture. Each chiplet requires thermal management and EMI isolation.
Our multi-layer diamond lids provide all three functions in one package: thermal spreading, EMI absorption, and electrical insulation.
Silicon photonics die with modulators, detectors, and waveguides.
CMOS driver and TIA circuitry adjacent to the PIC.
Multi-chip module with PIC + EIC + support dies, all under one composite lid.
Three functions, one diamond lid. Replaces discrete thermal interface material, EMI shield, and insulator.
Integrated temperature sensors within the diamond lid. Real-time monitoring without impacting thermal performance.
Multi-layer diamond with engineered EMI absorption. Eliminates cross-talk between dense optical and electronic components.
Diamond is naturally electrically insulating. Provides isolation between chiplets and lid without discrete insulator layers.
Sign in to see the full spec table, standard sizes, material properties, and target optical engine alignment for PIC, PIC+EIC, and MCM configurations. Custom DFM available for any footprint.