Co-packaged optics switches integrate optical engines directly adjacent to the switch ASIC, creating unprecedented thermal density. Diamond baseplates spread heat across the full switch package footprint.
Our Cu-metallized diamond baseplates provide thermal spreading while Cu routing layers enable electrical connections — all in a single package-compatible substrate.
8×800G port architectures with integrated optical engines.
Next-generation 102.4T switching with CPO support for AI cluster interconnects.
AI networking switch with CPO architecture, optimized for GPU cluster interconnect.
Diamond spreads heat across full package footprint
Custom copper routing for electrical signals and power delivery
Low TTV for die attach and reliable solder joints
DFM support for specific OEM switch packages and CAD data
Sign in to see the full spec table, standard dimensions, thermal properties, and target-component alignment for 51.2T to 102.4T CPO switches. Custom DFM is available for any footprint.