Co-packaged optics switches integrate optical engines directly adjacent to the switch ASIC, creating unprecedented thermal density. Diamond baseplates spread heat across the full switch package footprint.
Our Cu-metallized diamond baseplates provide thermal spreading while Cu routing layers enable electrical connections—all in a single package-compatible substrate.
8×800G ports with integrated optical engines. Target architecture under NDA.
Next-generation 102.4T switching with CPO support. Target architecture under NDA.
AI networking switch with CPO architecture. Optimized for GPU cluster interconnect.
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2,000 W/m·K diamond spreads heat across full package footprint
1-2 layer copper routing (single-side or both-sides) for electrical signals and power delivery
Ultra-flat surface for die attach and reliable solder joints
DFM support for specific OEM switch packages and CAD data