2025-06-12
The Future of Diamond Semiconductors
Why the world is shifting from Silicon to Carbon-based wide-bandgap materials.
Read NoteWide Bandgap
Thermal Conductivity
Heat Dissipation vs Silicon
Commercial Wafer Size
From AI speech engines to humanoid components. 6C Technology's diamond wafers enable what silicon cannot.
Enabling next-generation thermal management for extreme computing loads. Diamonds dissipate heat 15x more effectively than silicon.
Fast-charging infrastructure for EVs and high-voltage grid management.
Founded by Lambert Yeung (Harvard) and Dr. Lee Ka-Suen. 6C Technology has invested over US$10M throughout a 13-year journey from ideation to commercialization at Hong Kong Science Park.